Exynos 2600 utilizes Samsung’s HPB (heat pass block) packaging technology for heat control. At a technology event in South Korea, a top Samsung official disclosed the solution that the new Exynos chip adopts for heat dissipation.

According to ETNews, Exynos 2600 is the first chip that leverages Samsung’s HPB packaging technology to better control heat. The new packaging method has reportedly reduced the chip’s temperature by nearly 30%.

Simply put, HPB is a heat dissipation block packaged on top of the mobile AP along with DRAM. Samsung’s System LSI optimized the Exynos 2600’s design for HPB to realize a significantly lower temperature over the previous model.

Kim Dae-woo, Managing Director and Head of the Package Development Team at Samsung Electronics, stated:

“Packaging is no longer the final-stage process but the starting point of system innovation.” He added, “An approach is being taken to optimize the entire system, not just the performance of a single chip.”

Packaging has always been considered a back-end process that doesn’t affect the chipset’s performance or heat management. The Korean tech giant explored possibilities to revolutionize this aspect and make it beneficial.

Samsung has evolved the chip packaging to go beyond physical connection. As a result, the new solution also positively affects the SoC’s power, heat, and signal. Exynos 2600 will show decent improvements in heat control.

Galaxy S26 and S26 Plus may use Exynos 2600 in most markets. The US and China will welcome Snapdragon-powered models. Galaxy S26 Ultra may go solo with Qualcomm’s Snapdragon chip to avoid a sales slump in 2026.

• Samsung treads carefully with Exynos 2600, says Galaxy S26 chips still under evaluation

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