Think of DRAM, but in a NAND-like structure, that's the basic concept of 3D X-DRAM, a revolution for the memory markets, bringing higher densities for AI. 3D X-DRAM Is Now Closer To Reality, An HBM-Replacement That Offers Higher Densities For AI In 2023, US-based NEO Semiconductor announced its brand new project called 3D X-DRAM, which was going to address the DRAM capacity bottleneck by leveraging a 3D NAND-like architecture. The company also unveiled two 3D X-DRAM cells, which will be integrated into memory solutions based on 3D X-DRAM. These include 1T1C and 3T0C DRAM cells, offering up to 512Gb, a […]

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