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Qualcomm Claims Single-Core Leadership for Its First Server CPU, the Dragonfly C1000, Delivering 250+ Cores & 5 GHz By 2028

Qualcomm Claims Single-Core Leadership for Its First Server CPU, the Dragonfly C1000, Delivering 250+ Cores & 5 GHz By 2028

Qualcomm has introduced its first-ever CPU designed for Data Centers, the Dragonfly C1000, which leverages the Oryon architecture. Qualcomm Enters The Agentic AI CPU Race With Dragonfly C1000 Chip, Oryon-Based With Over 5 GHz Clocks, Over 250 Cores, & Aims To Achieve Single-Core Leadership One of the biggest announcements by Qualcomm today was its first release of a CPU for the data center segment, called the Dragonfly C1000. This is a chip purpose-built for Agentic AI & General-Purpose workloads, delivering best-in-class power efficiency and TCO. As per Qualcomm, the Dragonfly C1000 is based on a custom-designed Oryon core architecture that […]

Read full article at https://wccftech.com/qualcomm-single-core-leadership-first-server-cpu-dragonfly-c1000-250-cores-5-ghz-2028/

Qualcomm’s HBC Stacks Compute Beneath DRAM To Smash The AI Memory Wall, Claiming 6x The Bandwidth Per Watt Of HBM

A layered chip with gold-colored elements is shown above the text '200x capacity per watt vs. SRAM*'.

Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall. Qualcomm's HBC Is A Memory Accelerator That Is Stacked Under DRAM, Offering A Major Boost Versus Standard SRAM & HBM Configurations At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted memory bandwidth in a 3D stacked chip design. With this, Qualcomm aims to solve the memory bottlenecks that […]

Read full article at https://wccftech.com/qualcomm-hbc-stacks-compute-beneath-dram-to-smash-the-ai-memory-wall/

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