Samsung promises a greater than 20% performance boost with its HBM4E memory Samsung Electronics has begun shipping its “industry-first” 12-layer HBM4E memory modules to customers, strengthening its position in the next-generation HBM market. This follows Samsung’s HBM4 mass production and commercial shipments earlier this year. HBM4E delivers a stable pin speed of 14 Gbps, with […]

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FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory. FuriosaAI's Next-Gen AI Accelerator Features 2nm Chiplet Architecture, HBM4/E Memory Support for Massive AI Compute Clusters FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM & Agentic AI workloads. The next-generation design is going to go all-in on the AI inference segment as Agentic AI continues to see […]

Read full article at https://wccftech.com/furiosaai-ditches-gpu-playbook-for-2nm-broadcom-built-inference-chip-claims-hbm4-e-bandwidth-beats-gpus/