Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall. Qualcomm's HBC Is A Memory Accelerator That Is Stacked Under DRAM, Offering A Major Boost Versus Standard SRAM & HBM Configurations At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted memory bandwidth in a 3D stacked chip design. With this, Qualcomm aims to solve the memory bottlenecks that […]

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