AT&T’s subpar service and customer service were quickly in the negative spotlight when a customer on Reddit explained his horrible experience with the U.S. carrier concerning an iPhone 17 Pro that was supposed to arrive brand new at the designated address. Unfortunately, not only was the box shipped with a broken factory seal, but the device also had a smudged display, clearly indicating it had been opened before. Naturally, the first instinct would have been to return the product, which would have been a simple process, right? Wrong, and after the customer endured the excruciating after-sales support, he was charged triple […]

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Samsung’s Heat Pass Block (HPB) is currently applied to the Exynos 2600 and is an excellent implementation to help lower temperatures and improve thermal resistance by 16 percent. With reports doing the rounds that other chipset makers will also adopt this technology to their SoCs, the latest rumor now claims that Qualcomm will be implementing it in its Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6 later this year. Looking at the high clock speeds achieved by the Snapdragon 8 Elite Gen 5, the thermal limitations of passive coolers like vapor chambers are already being reached, requiring more […]

Read full article at https://wccftech.com/qualcomm-to-use-samsung-heat-pass-block-technology-for-snapdragon-8-elite-gen-6/

The inner display belonging to the iPhone Fold is one of the most complex pieces present in Apple’s first foldable smartphone, with the technology giant previously reported to be experiencing technical problems in eliminating the crease, which is an area that was earlier said to have been addressed by the company. As the firm explores Ultra-Thin Glass (UTG) panels of varying thickness, a fresh report states that Apple is also mulling the use of a polyimide film (PI) placed on top of this glass to improve scratch resistance. Assuming this is what the Cupertino firm is planning, the iPhone Fold will be […]

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Smartphone chipset revenues for MediaTek crossed $10 billion for Q4 2025, with SoCs like the Dimensity 9500 and Dimensity 8500 contributing to those figures as the Taiwanese firm targets a wider adoption of its premium silicon. However, with this segment accounting for a whopping 59 percent of the total quarterly revenue, MediaTek could face some trouble down the road, as previous estimates have stated that the company will face a decline in chipset shipments in 2026, thanks to rising DRAM and NAND flash costs, but will still hold the top position this year over its rivals. A closer look at the […]

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The M5 was announced back in October 2025, but Apple is just getting warmed up because it has plans to launch the M5 Pro, M5 Max, and M5 Ultra in the first half of 2026. Though the first two higher-end chipsets have been reported to launch around the time the company releases its macOS 26.3, it is the iOS 26.3 Beta that contains evidence of these SoCs. However, the release candidate only mentions two of the three silicon, casting a shadow of doubt in our minds as we discuss the details below. The M5 Pro wasn’t mentioned in the iOS 26.3 […]

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Samsung’s Galaxy S26 Ultra recently made its single-core and multi-core run on Geekbench 6, and just like its predecessors, the flagship features an overclocked version of Qualcomm’s Snapdragon SoC. This time, it was the Snapdragon 8 Elite Gen 5, whose performance cores were running at 4.74GHz instead of the default 4.61GHz. Despite this small frequency bump, our single-core and multi-core results are shown to be higher, which obviously makes us question a few things, starting with whether there’s any advantage to Samsung shipping its premium devices with a slightly faster chipset. An active cooling solution coupled with the diminishing returns […]

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The updated 14-inch and 16-inch MacBook Pro models that are rumored to launch in March with Apple’s new M5 Pro and M5 Max chipsets are expected to retain the same thermal solution as the previous models. Despite these SoCs being highly efficient, they do tend to get exceptionally hot. While the technology giant might not be too keen to introduce a revamped heatpipe layout or switch to a vapor chamber, a fresh rumor claims that TSMC’s 2.5D packaging will be utilized instead of the company’s Integrated Fan-Out (InFO) technology, helping improve heat dissipation and lower resistance. There are other advantages too, which […]

Read full article at https://wccftech.com/m5-pro-and-m5-max-to-move-to-2-5d-from-info-packaging-leading-to-improved-heat-dissipation/

In terms of image quality, LED TVs will always be surpassed by mini-LED technology by miles, but the problem is that the transition to an advanced display is always an expensive decision, unless you purchase a Hisense TV. On Amazon, the company’s QD7 family is not just available in multiple sizes, starting from 50 inches, but these will go easy on your wallet and go all the way up to 100 inches. Best of all, you only need $297.99 in cash to get started. For those looking for both media consumption and gaming, we recommend getting a Hisense mini-LED TV […]

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