Qualcomm may rely on Samsung HPB cooling tech, debuted in the Exynos 2600, for its next-gen Snapdragon processors.

Snapdragon 8 Elite Gen 6 and Gen 6 Pro may launch later in the year, and Samsung HPB cooling trick is reportedly being considered by Qualcomm. If the adoption materializes, it will improve the SoCs’ heat dissipation abilities.

Heat Path Block could be expanding this year

Samsung’s HPB (Heat Path Block) is a next-gen packaging tech utilized in the Exynos 2600. This chip will be used in the Galaxy S26 and S26 Plus, which improve heat flow and lower thermal resistance by up to 16 percent.

The new chip packaging technology allows internal heat to move outward more quickly. It helps the mobile platform maintain a stable internal temperature. That said, the application processor remains reliable even under heavy loads.

With Qualcomm planning major upgrades for the Snapdragon 8 Elite Gen 6 CPU, a modern cooling solution becomes a necessity. Samsung’s Heat Path Block fits nicely here, and Samsung already offered it to Apple and Qualcomm.

It’s said that the Snapdragon 8 Elite Gen 6 could reach around 5GHz, while the Gen 6 Pro could surpass 5GHz CPU speed. These chips are expected to be used in the Galaxy S27 and S27 Ultra next year alongside Exynos 2700.

Rumors have it that Samsung Foundry may also produce Snapdragon 8 Elite Gen 5 and Gen 6 using its 2nm GAA process. Qualcomm may offer a slice from its TSMC orders to maintain production costs of its next-gen chipsets.

Exynos 2600 is in mass production, and practical changes would be visible post-launch. It’s the world’s first processor made using 2nm technology. It rivals TSMC’s 3nm Snapdragon and Apple’s 3nm A series iPhone processors.

Via – wccftech

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