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AMD Taps GlobalFoundries for MI500’s Co-Packaged Optics as the Silicon Photonics Race With NVIDIA Heats Up

A gloved hand holds a silicon wafer in front of a GlobalFoundries logo, with an AMD-branded chip displayed on the right.

AMD will be leveraging GlobalFoundries for the development of its MRM Co-packaged Optic solution for the next-gen Instinct MI500 AI accelerators. GlobalFoundries & AMD Working Together on Co-Packaged Optics Hardware For Instinct MI500 Accelerators CPO or Co-Packaged Optics (Silicon Photonics) is the next-generation solution that reduces reliance on copper and harnesses light to transfer signals. These CPOs are packaged alongside hardware accelerators such as GPUs and will be a key solution for next-gen AI factories, offering improved interconnect latency and creating high-bandwidth connections between CPU and GPU. Both AMD and NVIDIA will be leveraging these technologies for their next-gen AI […]

Read full article at https://wccftech.com/amd-taps-globalfoundries-for-mi500-co-packaged-optics/

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