China’s largest semiconductor manufacturer, SMIC, is currently hindered by its failure to acquire advanced EUV machinery to mass produce wafers on the 5nm lithography or below. With no alternative to scale past this limitation, the need for innovation and creativity is absolutely vital, so a new 3D IC stacking solution is rumored to be incorporated on Huawei’s upcoming Kirin 9050 to improve performance. The one positive to take away from the latest rumor is that the SoC can beat Apple’s older A18 Pro. New packaging technology will enable the Kirin 9050 to stack components vertically to increase transistor density and […]

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