Panel-Level Packaging (FOPLP) and Glass Substrates are going to drive the next chapter in advanced packaging, with the market exceeding $8 Billion by 2030. The AI & HPC Segments Want To Move Beyond Organic Substrates & Wafer Packages To Meet Their Growing Compute Needs, & That's Where Panel-level Packaging & Glass Substrates Come In TSMC & Intel are the two major semiconductor firms that are accelerating next-gen glass core substrates for panel-level packages. These two technologies go hand in hand in powering the next generation of semiconductors and come with major advantages over traditional organic substrates and wafer-level packages. The […]

Read full article at https://wccftech.com/tsmc-intel-race-to-replace-organic-substrates-with-glass-panel-level-packaging-8-billion-market-by-2030/

The popular free-to-play open world Wuxia action RPG Where Winds Meet, already available on PC, PlayStation 5, Android and iOS, launched on Xbox Series S and X earlier this month, featuring exclusive benefits for Game Pass subscribers. The announcement also included a tease for the game's third major expansion, titled Hidden Mountain and slated for a July launch. Following the news, we had the opportunity to send a list of questions to developer Everstone Studio via publisher NetEase Games to learn more about the development of the Xbox version and the upcoming Hidden Mountain expansion, and to address other pain points […]

Read full article at https://wccftech.com/where-winds-meet-interview-hidden-mountain/