AMD's next-gen Zen 7 "Grimlock" CPUs are rumored to utilize TSMC's 1.4nm (A14) process tech & new packaging innovations. AMD Taps TSMC's A14 "1.4nm" Process Tech For Its Next-Gen Zen 7 "Grimlock" CPUs The Zen 6 architecture is yet to make a formal entry into mainstream server and consumer segments, and while mass production has already begun on TSMC's 2nm process tech, the company is now prepping its supply chain partners for the next-generation lineup. In a report by Taiwanese Commercial Times, it is said that AMD has begun supply chain preparations for its next-generation x86 CPU architecture called Zen […]

Read full article at https://wccftech.com/amd-zen-7-grimlock-cpus-utilize-tsmc-1-4nm-process-tech-foplp-packaging-launc-2028/