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Yesterday β€” 22 June 2026Tech

JEDEC Approves SPHBM4 to Break HBM’s Costly Packaging Bottleneck, Retaining HBM4-level Speeds With Standard Packages

22 June 2026 at 20:25

Micron HBM4 memory chip displayed next to its exposed circuitry on a black background.

SPHBM4 is a new JEDEC standard that aims to solve the high cost and packaging concerns with existing HBM technologies. HBM Demand Keeps on Surging, But The High-Cost Might Make JEDEC's Upcoming SPHBM4 A Better Alternative Almost all AI & HPC accelerators rolling out these days feature some form of HBM memory. The highest-end solutions are leveraging the latest HBM4 designs, and HBM4E is being sampled to the top chipmakers. But as demand continues to rise, and shortages persist in the premium DRAM segment, HBM has become a major bottleneck. The cost is one issue, but price surges are a […]

Read full article at https://wccftech.com/jedec-approves-sphbm4-to-break-hbm-costs-retain-hbm4-speeds-standard-packages/

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