Samsung is aiming to turn its mobile processor business profitable. To this end, Exynos 2700 is seemingly a prime candidate to push the company’s ambitions, with the chip estimated to power nearly half of Galaxy S27 units.

According to Korean media, Samsung could push Exynos 2700 to production in the second half of the year. It will be fabricated using the Samsung Foundry’s second-generation 2nm (SF2P) process technology with GAA.

More importantly, analysts believe that Samsung could power nearly half of the Galaxy S27 units with the Exynos 2700 processor next year. It’s going to be just double of what Samsung has achieved in the S26 series.

It’s said that Exynos 2600 is used in around 25 percent of the Galaxy S26 series units. With Exynos share ramping in the Galaxy S27 series, we may see a wider adoption, with Ultra potentially getting the company’s in-house chip.

This year, Samsung is using 75 percent Snapdragon and 25 percent Exynos in the Galaxy S26 series. The Galaxy S26 Ultra will be shipped with Snapdragon 8 Elite Gen 5 for Galaxy globally, while the other two models will see a chip split.

Exynos 2600 turned out to be a huge leap after the Exynos 2500 failure. Thanks to the second-generation 2nm node, Exynos 2700 will perform even better than the Galaxy S26’s Exynos 2600 application processor.

The US, Canada, and China usually maintain Snapdragon exclusivity. With Exynos share going around 50 percent, it looks like S27 Ultra may be powered by the Exynos 2700 chipset in some parts of the world, such as South Korea.

Nothing is certain as the development of the new chip is in the initial stage. We may see changes and final adoption numbers can only be believed at the verge of 2027.

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Samsung’s estimated chipset share of the Exynos 2600 found in the upcoming Galaxy S26 series is said to be 25 percent, with Qualcomm’s Snapdragon 8 Elite Gen 5 accounting for the remaining tally. Fortunately, this figure could see a drastic uplift next year with the arrival of the Exynos 2700. According to an analyst, not only is the chipset expected to enter mass production in the second half of this year, but Qualcomm isn’t going to be enjoying the lion’s share of its chipsets powering the Galaxy S27 family. The latest report states that the Exynos 2700 share of the Galaxy […]

Read full article at https://wccftech.com/exynos-2700-enter-mass-production-h2-2026-increased-adopting-in-galaxy-s27/

Wild rumors circulating online indicate that Samsung SDI is testing a dual-cell silicon carbon battery for the Galaxy S27 series and select Galaxy A phones, which has reportedly outclassed the 5200mAh threshold.

5000mAh, that number has haunted Galaxy phones for years. Every launch, every keynote, same ceiling, same polite promises about efficiency doing the heavy lifting. We’ve been too patient, but this alleged prototype says something very different.

According to the rumor (via phonefuturist), the Galaxy S27 generation is being lined up for a serious battery shake-up. We are talking about a dual-cell 5200mAh silicon carbon battery, not a marketing tweak, not a rounding error, but a real jump in energy density.

The prototype reportedly pushes past 450 Wh per kilogram in energy density. That is a massive leap over today’s lithium-ion packs. The result is a battery that is bigger in capacity, faster to charge, and still slim enough to fit.

This is built on a dual-cell silicon-carbon architecture. Simply put, the Korean tech giant is splitting the battery into two smaller cells and packing them with a new silicon-carbon material instead of the old graphite mix.

Silicon can store way more energy than graphite, but it is tricky and swells if you are careless. Samsung SDI has been grinding on this problem for years, and now it looks ready, with rumors even hinting at a 20000mAh prototype in the works.

Honor and Xiaomi have been flexing higher capacities and silicon-based cells while Samsung played it safe. That era looks done if these alleged Samsung SDI battery prototypes make it into the Galaxy S27 next year.

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Qualcomm may rely on Samsung HPB cooling tech, debuted in the Exynos 2600, for its next-gen Snapdragon processors.

Snapdragon 8 Elite Gen 6 and Gen 6 Pro may launch later in the year, and Samsung HPB cooling trick is reportedly being considered by Qualcomm. If the adoption materializes, it will improve the SoCs’ heat dissipation abilities.

Heat Path Block could be expanding this year

Samsung’s HPB (Heat Path Block) is a next-gen packaging tech utilized in the Exynos 2600. This chip will be used in the Galaxy S26 and S26 Plus, which improve heat flow and lower thermal resistance by up to 16 percent.

The new chip packaging technology allows internal heat to move outward more quickly. It helps the mobile platform maintain a stable internal temperature. That said, the application processor remains reliable even under heavy loads.

With Qualcomm planning major upgrades for the Snapdragon 8 Elite Gen 6 CPU, a modern cooling solution becomes a necessity. Samsung’s Heat Path Block fits nicely here, and Samsung already offered it to Apple and Qualcomm.

It’s said that the Snapdragon 8 Elite Gen 6 could reach around 5GHz, while the Gen 6 Pro could surpass 5GHz CPU speed. These chips are expected to be used in the Galaxy S27 and S27 Ultra next year alongside Exynos 2700.

Rumors have it that Samsung Foundry may also produce Snapdragon 8 Elite Gen 5 and Gen 6 using its 2nm GAA process. Qualcomm may offer a slice from its TSMC orders to maintain production costs of its next-gen chipsets.

Exynos 2600 is in mass production, and practical changes would be visible post-launch. It’s the world’s first processor made using 2nm technology. It rivals TSMC’s 3nm Snapdragon and Apple’s 3nm A series iPhone processors.

Via – wccftech

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