With just around a week left till Samsung formally unveils its latest lineup of foldables, the South Korean tech giant has now removed the wraps from one of the biggest mysteries of the upcoming launch galore: how the Galaxy Z Fold 8 and Fold 8 Ultra will keep the dreaded display crease at bay. Samsung's Titanium Flex involves an extremely thin titanium-alloy film that sits just beneath the OLED panel, and bolstered by an underlying titanium plate Samsung's Titanium Flex is an inventive solution to the display crease problem that has plagued nearly every foldable till now, and involves 2 […]

Read full article at https://wccftech.com/samsungs-titanium-flex-involves-a-structure-just-30-the-width-of-a-human-hair-and-is-the-secret-sauce-behind-the-galaxy-z-fold-8s-creaseless-display/

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand. Intel & Other Advanced Packaging Chip Manufacturers See Surge In Orders From TSMC Customers As CoWoS Unable To Meet Industry Demand AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen. Leading this advanced packaging race is none other than TSMC, […]

Read full article at https://wccftech.com/tsmc-cant-keep-up-with-cowos-demand-advanced-packaging-orders-spilling-over-to-intel-rival-fabs/

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