The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC is working with Innolux and Ibiden as part of these efforts. TSMC Gears Up For Glass Substrate Development By Sharing Plan With Suppliers According to the details, the two companies that TSMC is in touch with are its suppliers for Ajinomoto Buildup Film (ABF) and […]

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