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Samsung Begins HBM4 Memory Mass Production With Up To 13 Gbps Speeds & 48 GB Capacities

A Samsung HBM4 memory chip displayed on a patterned yellow surface.

Samsung has officially commenced mass production and shipment of its next-gen HBM4 memory with up to 13 Gbps speeds & 48 GB capacities. Samsung Commences Mass Production & Shipment of HBM4 Memory: Up To 13 Gbps Speeds, 3.3 TB/s Bandwidth Per Stack, & 48 GB Capacities In 16-Hi Stacks HBM4 will be the next-generation memory standard adopted by powerful datacenter chips such as NVIDIA's Vera Rubin and AMD's Instinct MI450 series. The new standards offer more than just speed improvements, with the highlights listed below: Press Release: Samsung Electronics, a global leader in advanced memory technology, today announced that it […]

Read full article at https://wccftech.com/samsung-hbm4-memory-mass-production-with-up-to-13-gbps-48-gb-capacities/

Intel’s β€œBSPDN” Power-Delivery Method on 18A Is a Major Technical Win That May Also Be Holding Back Customers For Now

Man in Intel Foundry vest holding a silicon wafer in front of an Intel sign outdoors.

Intel's 18A process was a breakthrough for the foundry division, especially with a successful Panther Lake launch, but here's why external adoption is limited for now. Intel's PowerVia Technology Paves The Way Towards Future Customer Commitments, But Not Right Now Intel Foundry has been struggling with customer commitments for several years now, but the division has worked extensively on the 18A process, with foundations laid by ex-CEO Pat Gelsinger. The node has seen recent success with its integration into the Panther Lake lineup, and given how Intel's latest APU platform has turned out, experts are optimistic about Intel Foundry's progress. […]

Read full article at https://wccftech.com/intels-bspdn-on-18a-is-a-major-technical-win-that-may-also-be-holding-back-external-adoption/

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