ASML confirms that Intel has brought High NA EUV into high-volume production ASML has reported that Intel Foundry is now using its High NA EUV technology on its Intel 18A process node to produce a “subset of its Intel Core Ultra 3 processors”. This is the first time that High NA EUV machines have been […]

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Intel has reportedly secured some big wins with its 18A, 14A, and EMIB process / advanced packaging technologies, signaling massive interest in its Foundry business. Tech Heavyweights Are Lining Up To See What Intel Foundry Has To Offer As 18A, 14A & EMIB Technologies See Heightened Interest TSMC has so far been the only semiconductor manufacturer to offer bleeding-edge processes and packaging technology, but Intel has quickly emerged as a fierce competitor. Intel has only launched its 18A node, which is already achieving volume ramp, and is working towards its more advanced 18A-P (In Risk Production) and 14A nodes (Risk […]

Read full article at https://wccftech.com/intel-foundry-snags-amd-nvidia-openai-as-design-wins-on-18a-14a-nodes/

Intel has invested €5 billion at its Ireland Fab34 to expand manufacturing of its "Intel 3" tech that will be used in Xeon 6 & Next-Gen Xeon chips. Intel's Key Data Center Fab In Ireland Gets €5 Billion Invested Towards Manufacturing, Will Be Used To Scale "Intel 3" For Xeon 6 & Next-Gen Xeon CPUs Today, Intel is announcing a €5 billion investment at its Leixlip campus, which is based in Ireland. This investment is part of a broader manufacturing expansion plan for the European region. The investment comes as the need for AI and high-performance chips is growing at […]

Read full article at https://wccftech.com/intel-pours-5-billion-in-ireland-scaling-intel-3-xeon-6-and-diamond-rapids-production/

Intel has unveiled its latest SoCs, codenamed Starfire, that offer space-grade survivability and are based on the 18A process technology. Intel Rolls Out Space-Grade "Starfire" Chips With 8 Cores, 18A Tech, & 10+ Years of Lifetime Space-grade platforms require extra engineering as they are built to withstand various aspects of space, such as exposure to radiation and extreme temperatures. Plus, these chips need to offer utmost levels of stability as space systems need to retain a steady operation throughout their life-cycle. As such, Intel has new space-grade chips ready for the market. Codenamed Starfire, the SoCs are manufactured in the […]

Read full article at https://wccftech.com/intel-brings-18a-silicon-to-orbit-with-starfire-space-grade-soc/

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand. Intel & Other Advanced Packaging Chip Manufacturers See Surge In Orders From TSMC Customers As CoWoS Unable To Meet Industry Demand AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen. Leading this advanced packaging race is none other than TSMC, […]

Read full article at https://wccftech.com/tsmc-cant-keep-up-with-cowos-demand-advanced-packaging-orders-spilling-over-to-intel-rival-fabs/

Altera has cut Intel transition service agreements from 125 to 15 as it develops new chip technologies.