TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage. Panel-Level Packaging Is The Next Logical Step for TSMC As It Eyes CoPoS "Glass Core Substrate" Technology Over CoWoS The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward. In a recent report by Commercial Times Taiwan, it is reported that TSMC is now aggressively moving towards CoPoS (Chip-On-Panel-on-Substrate) as a replacement to […]

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Intel CEO Lip-Bu Tan discussed his experience working with Elon Musk for the Terafab project and the impact that booming demand for artificial intelligence is having on the semiconductor supply chain. Tan made the remarks during the No Priors: AI, Machine Learning, Tech, & Startups podcast as he praised the trillionaire entrepreneur and commented on the memory shortage. Intel CEO Lip-Bu Tan Couldn't Stop Praising Elon Musk The discussion started with Elon Musk's Terafab project through which he aims to meet the demand for chips for his cars, robotics and plans for space-based data centers. Intel will manufacture chips for […]

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ACE, the upcoming set of x86 Extensions defined by both AMD & Intel, has seen the latest spec release, focusing on AI acceleration. AMD & Intel Focus on AI Acceleration Through Next-Gen x86 Architectures That Are ACE Compliant Last year, Intel and AMD partnered to strengthen the x86 ecosystem through their "x86 Ecosystem Advisory Group" initiative. The plan was to offer a standardized set of features across architectures to make x86 accessible, scalable, and compatible with future requirements. Four key features were announced: FRED, AVX10, ChkTag, and ACE. Now, the latest ACE "AI Compute Extensions" specifications have been published by AMD […]

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Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO. Intel Foundry Gets SK Hynix's Ex-CEO, Seok-Hee Lee, Bringing Years of Experience In The Advanced Packaging & Back-End Technology Segment Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers. […]

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Chip manufacturing giant Intel has partnered up with Taiwan's second-largest contract chip manufacturer, United Microelectronics Corporation (UMC), for advanced manufacturing process technology, suggests a report from FundaAI. Intel, under its CEO Lip-Bu Tan, is seeking to compete with Taiwan's TSMC in the contract chip manufacturing industry. According to the details, UMC is seeking to team up with Intel to gain a foothold in advanced chip manufacturing without having to expend significant amounts of capital for the machinery. Intel & Taiwan's Second Largest Chip Manufacturer Team Up For 12nm & 3nm Nodes - Report While most of the focus when it […]

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In a late-night Truth Social post that all but confirms persistent supply chain-sourced rumors and tidbits, President Trump has spilled the beans on Apple's chip fabrication deal with Intel, setting off a speculative storm as to what's next for the now-ascendant chipmaker. Trump details how he helped Intel, takes credit for nudging NVIDIA, Elon Musk's Terafab, and Apple towards the chipmaker Trump has just taken a victory lap of sorts by touting Intel's rapidly expanding orderbook, which now apparently includes such august customers as NVIDIA, Elon Musk's Terafab project, and Apple, going on to boast about the U.S. government's 10 […]

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