The XRING 01 is proof that Xiaomi can make its own mark in the custom silicon game for smartphones and to ensure that it can hold its position against the likes of Qualcomm and MediaTek for future releases, the Chinese manufacturer is projected to invest a gargantuan sum of 200 billion yuan (approximately $28 billion) in R&D. Of course, not all of this amount will go towards the development of future SoCs, but a few billion is all Xiaomi needs. With one million XRING 01 units shipped, Xiaomi looks to cement its position as a threat to its new chipset rivals […]

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TSMC’s 2nm process will be showcased for the first time, with Apple being one of the recipients to leverage this technology in its upcoming A20 and A20 Pro. While the move from the 3nm ‘N3P’ node to the 2nm ‘N2’ will improve efficiency by a decent margin, Apple’s expertise in chip design will ensure that the iPhone 18 Pro and iPhone 18 Pro Max deliver record battery life. A20 and A20 Pro efficiency cores could once more come to the rescue as Apple showcased incredible ‘performance per watt’ with the A19 Pro Even though Qualcomm and MediaTek will overtake Apple in […]

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The first Glass Core Substrate prototypes, featuring co-packaged optics, were pictured at OFC 2026, giving us a glimpse of future chips. First Glass Core Substrate Prototypes Surface at OFC 2026 With Co-Packaged Optics, Hinting at What 2029 AI Chips Will Look Like At the Optical Fiber Communication Conference 2026, Dr. Ian Cutress of More Than Moore spotted prototypes of a glass-core substrate-based chip with an AOP (Active Optical Package). These prototypes (mockups, as Dr. Ian puts it) are a showcase of what next-generation chips will look like. Glass Core substrates have been gaining interest, as they have several benefits over […]

Read full article at https://wccftech.com/intel-glass-substrate-bet-inches-closer-to-reality-as-first-prototypes-co-packaged-optics-pictured/

Alibaba has unveiled its latest AI chip, "Zhenwu M890" and AI LLM "Qwen3.7-Max", designed for Agentic AI workloads. As Agentic AI Rages On, Alibaba Rolls Out Its Own AI Chip & AI LLM: Meet Zhenwu M890 GPU & Qwen3.7-Max Model The Alibaba Zhenwu M890 is based on the company's in-house PPU (Parallel Processing Unit) architecture and features a Transformer core engine. The chip is designed for Agentic AI workloads with a focus on AI inferencing, offering 0.6 PFLOPs of FP16 (Half-Precision) compute, which is comparable to the A100 from NVIDIA, and three times faster than the Hopper H20 solution. The […]

Read full article at https://wccftech.com/alibaba-targets-nvidia-hopper-with-zhenwu-m890-ai-chip-claiming-3x-h20-performance/

Tata plans to invest US$11 billion in a semiconductor fab in Dholera, India.

Arm is also under investigation by South Korea’s antitrust regulator amid licensing scrutiny.