Apple’s M5 Pro, M5 Max To Offer Better Heat Dissipation And Low Resistance As A Result Of Switching From InFO Packaging To 2.5D, Which Also Reduces Defected Chips Rate
The updated 14-inch and 16-inch MacBook Pro models, rumored to launch in March with Apple’s new M5 Pro and M5 Max chipsets, are expected to retain the same thermal solution as the previous models, and despite these SoCs being highly efficient, they do tend to get exceptionally hot. While the technology giant might not be too keen to introduce a revamped heatpipe layout or switch to a vapor chamber, a fresh rumor claims that TSMC’s 2.5D packaging will be utilized instead of the company’s InFO (Integrated Fan-Out) technology, helping improve heat dissipation and lower resistance. There are other advantages too, which we’ve […]
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