Samsung's next-generation NAND Flash for SSDs will offer over 900+ layers, with two stacks bonded together for increased storage capacities. Samsung Wants To Bond Two NAND Cells Together, Forming A Large 900-1000+ Layer Storage Solution For Future SSDs Last month, we reported that Samsung was working towards 1000-layer NAND using brand new materials and bonding technologies. At the VLSI Symposium 2026, Samsung has revealed its full plans on how they aim to achieve that goal. In its latest slide, Samsung states that there's a big demand for high-capacity SSDs, and they are working towards an accelerated roadmap that focuses on […]

Read full article at https://wccftech.com/samsung-bonds-two-450-layer-nand-cells-chasing-1000-layer-ssds-quadruple-capacity-2030/

Consumer-focused DRAM saw a major spike in prices in Q2 vs Q1, with DDR4 memory floating at 50% and LPDDR around 80% due to persistent shortages. Consumer DRAM Prices Jumped Over 50% In Q2 vs Q1, DDR4 Now Averages 50%, While LPDDR Up To 89% Expensive DRAM makers are only focused on making profits rather than thinking about the widespread impact their prioritizations have on the consumer segment. With AI being on top of the list, general-purpose DRAM, which includes DDR and LPDDR memory, has faced the brunt of the widespread shortages, leading to massive price hikes. In the latest […]

Read full article at https://wccftech.com/memory-shortages-destroy-consumer-segment-dram-prices-surge-89-percent/

SK Hynix is planning to return to general-purpose DRAM, such as DDR5, after securing record revenue from HBM memory. SK Hynix Reportedly Finds No Reason To Accelerate Its HBM Production, Will Instead Focus on DDR5 Memory As Shortages Get Severe In The General-Purpose DRAM Segment HBM has been the main driver for the big three DRAM manufacturers for the last couple of months due to increased demand from AI firms. This has led to record profits for Samsung, Micron, and SK Hynix. At the same time, these companies stopped focusing production on general-purpose DRAM solutions such as DDR5. But now […]

Read full article at https://wccftech.com/after-earning-major-profits-from-hbm-sk-hynix-now-plans-to-prioritize-ddr5-dram-production/

Microsoft introduced DirectX Dump Files in public preview, allowing developers to get their hands on the newest feature aimed at making GPU crash debugging easier. Microsoft DirectX Dump Files Help Developers Debug GPU Crashes More Efficiently Historically, debugging GPU-related crashes in video games has been a headache for developers. With the dizzying amount of possible combinations of hardware, drivers, and OS versions, and the fact that reproducing crashes in the first place is tough, the whole process is a struggle. That's why Microsoft has been working on a cross-vendor solution to GPU debugging for some time now. By collaborating on […]

Read full article at https://wccftech.com/microsoft-preview-directx-dump-files-amd-first-with-public-driver/

Steam Machine is here, but it comes at a really high price point, which makes these sub-$1000 PCs a far better value. Valve's Steam Machine Comes In At A Very High Price Tag, Making Pre-Built & DIY PCs A Better Option For Gamers Well, the Steam Machine is officially here. It is the latest hardware launch by Valve, a company all gamers know and love. The creators of the highly successful Steam Deck have now introduced a full-fledged PC that offers the convenience of a console thanks to its compact design. We talked about the specs and initial benchmarks a […]

Read full article at https://wccftech.com/steam-machine-lands-at-1049-1000-usd-pre-builts-faster-gpus-double-memory-storage/

SPHBM4 is a new JEDEC standard that aims to solve the high cost and packaging concerns with existing HBM technologies. HBM Demand Keeps on Surging, But The High-Cost Might Make JEDEC's Upcoming SPHBM4 A Better Alternative Almost all AI & HPC accelerators rolling out these days feature some form of HBM memory. The highest-end solutions are leveraging the latest HBM4 designs, and HBM4E is being sampled to the top chipmakers. But as demand continues to rise, and shortages persist in the premium DRAM segment, HBM has become a major bottleneck. The cost is one issue, but price surges are a […]

Read full article at https://wccftech.com/jedec-approves-sphbm4-to-break-hbm-costs-retain-hbm4-speeds-standard-packages/

NVIDIA's AI prowess is being deployed across Europe with 35 brand new supercomputers offering 800 Exaflops of compute. Europe Is Building 35 All-NVIDIA AI supercomputers, including Hopper, Blackwell & Rubin Deployments That Scale Up To 800 Exaflops European nations are going into a supercomputer-frenzy, and the main driver behind them is NVIDIA's latest AI ecosystem, delivering up to 800 Exaflops of deployed & announced capacities that will deliver record levels of AI compute. Today, at ISC 2026, NVIDIA and its partners unveiled this multi-year collaboration, which will encompass several deployments across 23 countries. With these supercomputers, Europe is aiming to […]

Read full article at https://wccftech.com/nvidia-floods-europe-with-35-supercomputers-23-countries-800-exaflops-ai-compute/

AMD has officially launched FSR 4.1 for Radeon RX 7000 GPUs while confirming support for RDNA 3.5 & RDNA 3 GPUs coming soon. AMD Radeon RX 7000 GPU Owners Can Now Enjoy FSR 4.1 Upscaling Across 300+ Games Last month, AMD announced that it would finally bring FSR 4.1 upscaling to its older GPUs. This was a highly requested feature by Radeon owners who felt left out, especially when NVIDIA was rolling out its latest upscaling models to GPUs that were much older. In the previous announcement, AMD confirmed that Radeon RX 7000 "RDNA 3" and Radeon RX 6000 "RDNA […]

Read full article at https://wccftech.com/amd-rolls-out-fsr-4-1-rx-7000-gpus-builds-lightweight-ml-model-rdna-3-5-rdna-3-igpus/

Micron and Anthropic have announced a strategic agreement to scale next-generation AI infrastructure that spans memory and storage for rising compute demands. Micron Signs Supply Agreement With Anthropic While Expanding Claude Adoption Press Release: Micron Technology today announced a strategic agreement with Anthropic that spans memory and storage AI architecture design, supply and demand, enterprise adoption of Claude across Micron, and a strategic investment in Anthropic’s Series H funding round. The agreement directly links the demands of frontier AI models to how infrastructure is designed, supplied, and deployed at scale. AI Memory and Storage Infrastructure Frontier AI models demand uncompromising […]

Read full article at https://wccftech.com/micron-deploys-claude-to-accelerate-ai-factories-anthropic-fund-multi-year-backing-support/

SanDisk is looking for more innovative solutions to address memory limitations, such as stacking NAND Flash within chips. Memory Limitations Push DRAM/NAND Maker To Get More Innovative, SanDisk Proposes The Stacking of NAND Flash Within Chips The rapid rise of AI & the proportional demand for compute has led to the exposure of bottlenecks, which are pushing DRAM and NAND manufacturers into going with the out-of-the-box approach. In the past, chipmakers called it a day by introducing new memory technologies, and DRAM was the primary component. But the rise in costs, development/yield drawbacks, & increased power have led to a […]

Read full article at https://wccftech.com/sandisk-bets-on-stacking-nand-and-compute-on-one-chip/

Qualcomm is working on a new refresh of its existing Snapdragon X2 CPU family, which will feature various options. Snapdragon X2 Refresh Might Be Coming Before Next-Gen X3 Series, As Qualcomm Starts Listing Various Configurations The Snapdargon X2 lineup comes in three flavors: X2 Elite Extreme, X2 Elite, and X2 Plus. The CPU family starts at 6 cores and goes all the way up to 18 cores. This year at Computex 2026, we saw the launch of the entry-tier Qualcomm C-Series chips, but these aren't the same as Snapdragon X2 offerings. While Qualcomm should be working on its next-generation X3 […]

Read full article at https://wccftech.com/qualcomm-preps-snapdragon-x2-cpu-refresh-stalling-x3-as-memory-shortages-bite/

The Linux 7.2 Kernel Patches have seen the addition of a next-gen NVIDIA GPU architecture, cleverly listed as "Blackwell-Next". NVIDIA Ramps Up Support For Next-Gen GPU Architectures, Including Blackwell-Next, For Linux 7.2 NVIDIA's GPU architectures are not a mystery since the company has been outlining them in roadmaps for years now. We knew that Rubin was going to replace Blackwell years before its launch, and now we know that Feynman will replace Rubin. NVIDIA has only started volume production of Rubin, but internally, the company is prepping some big support for its next-generation architectures before they even ship. Phoronix spotted […]

Read full article at https://wccftech.com/nvidia-prepares-next-gen-gpu-architectures-blackwell-next-spotted-in-linux-7-2/

Ah, the ultimate PC gaming boogeyman: “Is my CPU bottlenecking my graphics card?” It’s the first question we ask ourselves when building a new rig, slapping in a shiny GPU upgrade, or wondering why a game feels like a stuttery mess despite dropping a small fortune on PC hardware. But here is the hard truth, folks: a bottleneck isn’t a permanent stamp on your PC. It is a dynamic, fast-shifting state dictated by the specific game you're playing, the resolution you're running, your graphics presets, and your target framerate. Your system can be completely GPU-bound in a graphically heavy AAA […]

Read full article at https://wccftech.com/how-to/cpu-or-gpu-bottleneck-how-to-diagnose-whats-really-limiting-your-gaming-performance/

TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage. Panel-Level Packaging Is The Next Logical Step for TSMC As It Eyes CoPoS "Glass Core Substrate" Technology Over CoWoS The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward. In a recent report by Commercial Times Taiwan, it is reported that TSMC is now aggressively moving towards CoPoS (Chip-On-Panel-on-Substrate) as a replacement to […]

Read full article at https://wccftech.com/tsmc-accelerates-copos-packaging-replace-cowos-as-glass-core-substrates-cut-costs-boost-wafer-utilizatio/

NVIDIA's Vera Rubin is entering data centers soon, and the rise of Agentic AI also comes with a mammoth rise in costs. NVIDIA Vera Rubin AI Data Centers Will Be Expensive To Build & Will Consume Lots of Power, A Single GigaWatt Installation Could Cost Roughly $50 Billion The Vera Rubin era is upon us. The first systems are already being shipped to major cloud providers who are validating and testing them before bringing them up on scale. With the full volume production already going on, NVIDIA is eyeing an even bigger success than Blackwell. But as these systems are […]

Read full article at https://wccftech.com/foxconn-pegs-nvidia-vera-rubin-ai-datacenter-at-47-billion-per-gigawatt/

It's been three years since the AMD AM5 motherboard platform and the 600-series motherboards launched. Since its launch, the platform has seen the launch of several CPUs in the Ryzen 7000, Ryzen 8000, and Ryzen 9000 families. While the 600-series motherboards provide great features & compatibility with newer Zen 5 CPUs, motherboard makers are always looking to enhance user experiences through the latest technologies, so AMD has introduced a new chipset line called the 800-series. AMD also introduced both X870 and B850 series chipsets for high-end and mainstream AM5 motherboards. Both of these chips provide brand-new designs and brand-new features […]

Read full article at https://wccftech.com/review/asrock-x870-challenger-wifi-white-motherboard-review/

It's been three years since the AMD AM5 motherboard platform and the 600-series motherboards launched. Since its launch, the platform has seen the launch of several CPUs in the Ryzen 7000, Ryzen 8000, and Ryzen 9000 families. While the 600-series motherboards provide great features & compatibility with newer Zen 5 CPUs, motherboard makers are always looking to enhance user experiences through the latest technologies, so AMD has introduced a new chipset line called the 800-series. Now, AMD has introduced both X870 and B850 series chipsets for high-end and mainstream AM5 motherboards. Both of these chips provide brand-new designs and brand-new […]

Read full article at https://wccftech.com/review/gigabyte-x870e-aero-x3d-dark-wood-motherboard-review-supreme-aesthetics/