Intel has reportedly secured some big wins with its 18A, 14A, and EMIB process / advanced packaging technologies, signaling massive interest in its Foundry business. Tech Heavyweights Are Lining Up To See What Intel Foundry Has To Offer As 18A, 14A & EMIB Technologies See Heightened Interest TSMC has so far been the only semiconductor manufacturer to offer bleeding-edge processes and packaging technology, but Intel has quickly emerged as a fierce competitor. Intel has only launched its 18A node, which is already achieving volume ramp, and is working towards its more advanced 18A-P (In Risk Production) and 14A nodes (Risk […]

Read full article at https://wccftech.com/intel-foundry-snags-amd-nvidia-openai-as-design-wins-on-18a-14a-nodes/

Tesla is all set to begin production of its AI5 chip on Samsung's 2nm process technology after a successful tapeout back in April. Samsung & TSMC To Produce Tesla's AI5 Chip With The Former Leveraging Its 2nm Capabilities Last month, Elon Musk announced the successful tape-out of its AI5 AI chip. Elon shared pictures of the chip, featuring a large primary die in the middle that will handle all of the compute and 12 DRAM modules on the outskirts, offering high capacity and efficiency-optimized bandwidth. The DRAM modules in the picture are from SK hynix, and while the DRAM SKU […]

Read full article at https://wccftech.com/samsung-2nm-node-lands-tesla-ai5-chip-at-its-texas-taylor-fab-silencing-yield-doubters/

The family of TSMC’s first 2nm chipsets is yet to grace the industry, and the Taiwanese giant is already experiencing unprecedented advancements with its next-generation lithography, A14, or 1.4nm. Previously, it was Samsung that would obtain bragging rights over introducing the first cutting-edge technology, but that title now seemingly belongs to its foundry rival, which will reportedly complete the construction of its first fabrication plant for the new process in 2027, with trial production happening shortly after. First fabrication plant reported to be completed in April 2027, with mass manufacturing of the 1.4nm process starting in 2028 Construction of the […]

Read full article at https://wccftech.com/tsmc-1-4nm-process-no-roadblocks-first-fab-to-be-completed-in-2027/

In the AI race, Apple isn’t the first name that you’d expect to be ahead of its rivals, but when it comes to chipsets that are tailor-made to tackle the aforementioned workloads, we doubt other names come to mind. While we have reported that the M7 is being designed to bring even better on-device AI performance to the table, the M8 is expected to surpass its predecessor in this aspect, while also being one of the company’s first silicon ranges to leverage a new manufacturing process. M8 could be Apple’s first 1.4nm SoC designed for powerful computing, bringing superior efficiency […]

Read full article at https://wccftech.com/apple-working-on-m8-with-superior-ai-and-efficiency-features/

TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand. Intel & Other Advanced Packaging Chip Manufacturers See Surge In Orders From TSMC Customers As CoWoS Unable To Meet Industry Demand AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen. Leading this advanced packaging race is none other than TSMC, […]

Read full article at https://wccftech.com/tsmc-cant-keep-up-with-cowos-demand-advanced-packaging-orders-spilling-over-to-intel-rival-fabs/