Apple explores Intel, Samsung as backup chipmakers


The growth in agentic AI software will lead to high demand for CPUs in the AI era, believes investment bank UBS. In an investment note, the bank explains that agentic AI increases the workload for processors. It adds that this workload typically favors firms that offer chips with higher cores and are able to cater to power efficiency. As a result, UBS outlines that in the era of agentic AI workloads, chips from Arm and then AMD are slated to benefit the most, with Intel also benefiting as the total addressable market (TAM) grows. Agentic AI Workloads To Favor CPUs [β¦]
Read full article at https://wccftech.com/arm-and-amd-poised-to-eat-intels-lunch-in-agentic-ai-era-analyst-warns-as-core-counts-could-jump-5x-per-gpu/

Intel has placed a massive order at Taiwanese manufacturers to secure advanced packaging equipment, which will be used for its EMIB plans. Intel Bets Big on EMIB, As The Company Has Placed A Huge Order To Secure Advanced Packaging Equipment From Taiwan EMIB, the advanced packaging solution and alternative to TSMC's CoWoS, has been making headlines for some time now. The packaging technology is gaining lots of momentum as potential customers line up to utilize the tech for their upcoming chips, mainly for AI purposes. This demand has now led Intel to go after Taiwanese manufacturers to secure the equipment [β¦]
Read full article at https://wccftech.com/intel-places-huge-advanced-packaging-equipment-order-signaling-huge-emib-interest/

Intel has accelerated its PC roadmap, with several chips including Nova Lake, Razor Lake, Titan Lake & Moon Lake on track to tackle AMD. Intel To Offer Four PC CPU Families In The Next Two Years As It Positions Its Lineup To Compete Aggressively Against AMD, Apple & Qualcomm Chipzilla is going aggressive not only on the Foundry front, but also in its PC business as it remains on track to offer four diverse chip families in the next two years. This shows heightened confidence at Intel as its PC platform execution not just accelerates, but also gets back on [β¦]
Read full article at https://wccftech.com/intel-pc-platform-roadmap-on-track-to-tackle-amd-nova-lake-razor-lake-titan-lake-moon-lake-cpus/

Apple has once again raised the possibility of making its chips at Fabs besides TSMC, as it is in early talks with Intel and Samsung. Intel & Samsung Emerge As Potential Fix To Apple's Supply Constraints Affecting Its Consumer Chips Bloomberg has just dropped some big news surrounding Apple, which is in early talks with Intel and Apple to secure additional supply for its consumer lineup. The report highlights that Apple has held "exploratory" discussions with the two semiconductor firms as it aims to diversify the production of its chips. The company has so far relied upon TSMC for its [β¦]
Read full article at https://wccftech.com/apple-eyes-intel-samsung-fabs-in-early-stage-talks-a-rare-crack-decade-long-tsmc-loyalty/

TSMC is turning into a victim of its own success as the world's preferred chip foundry, leaving its heretofore prized customers such as Apple in a bind of sorts as they suddenly find themselves crowded out by AI hyperscalers. In its frustration, Apple is now reportedly exploring the possibility of dividing up its silicon load between Samsung, Intel, and TSMC rather than remaining largely TSMC-exclusive. Apple is looking for contingencies by tentatively probing Intel and Samsung as additional vectors for manufacturing its custom chips According to Bloomberg's Mark Gurman, Apple has already held "early-stage talks" with Intel for using its [β¦]
Read full article at https://wccftech.com/apple-quietly-courts-intel-and-samsung-for-its-most-critical-chips-as-tsmcs-advanced-nodes-remain-choked-under-ai-demand/

As rumors suggest that Google is interested in using Intel for its next-generation tensor processing unit (TPU) chips, well known analyst Ming-Chi Kuo has shared his thoughts on the matter. The analyst believes that yields will be a key factor in Google's decision, especially since the technology giant has started to focus on cost savings for the Humufish next-generation TPU's design. Intel's Yields With The EMIB-T Packaging Technology Will Play Key Role In Google's TPU Orders, Says Analyst Intel's EMIB-T packaging technology, short for Embedded Multi-die Interconnect Bridge Through Silicon Vias (EMIB-T) relies on using a 'bridge' that is embedded [β¦]
Read full article at https://wccftech.com/analyst-warns-googles-intel-tpu-bet-hinges-on-a-brutal-yield-jump-from-90-to-98/

The flagship Bartlett Lake chip can be a bit faster than the flagship Raptor Lake Refresh CPU, but this isn't the case in ever game. Bartlett Lake 12-P-Core Chip Delivers 5-9% Higher Performance in Games Than 24-Core Intel Core i9 14900K Intel's Bartlett Lake is an interesting CPU lineup, despite not being meant for the consumer segment. We have previously seen some users making efforts in running the flagship Bartlett Lake chip on a regular LGA 1700 motherboard, as technically, the Bartlett Lake CPUs are compatible with the LGA 1700 socket. Since no official BIOS is available from Intel, mainstream [β¦]
Read full article at https://wccftech.com/intel-core-9-273pqe-is-reportedly-up-to-9-faster-in-gaming-vs-core-i9-14900k/

Intel has made two big changes: the appointment of Alex Katouzian from Qualcomm in the Client Computing & AI segment, along with Purskar Randae as CTO. Alex Katouzian Appointed to Lead Intel's Client Computing & Physical AI Group Press Release: Intel Corporation today announced two key leadership appointments to strengthen its core product business and advance the companyβs innovation agenda. Alex Katouzian will join Intel as executive vice president and general manager of the Client Computing and Physical AI Group. In this role, Katouzian will align Intelβs client computing business with emerging physical AI systems that span robotics, autonomous machines, [β¦]
Read full article at https://wccftech.com/intel-appoints-qualcomm-alex-katouzian-to-lead-client-computing-physical-ai-lip-bu-tan-reshapes-top-ranks/

AMD's immense success for its CPUs and GPUs in the AI segments will be a key driver for the company in the current year & the years ahead. AMD Is Expected To Ship Nearly 1.9 Million AI GPUs By 2027, While It's Share In China Will Be Larger Than NVIDIA's Intel, gaining momentum this quarter, thanks to Agentic AI's reliance on CPUs, has given us a teaser of what to expect from AMD's upcoming earnings. As per UBS, AMD isn't as constrained as Intel in the CPU segment and is anticipated to grow its Server CPU revenue by 80% this [β¦]
Read full article at https://wccftech.com/amd-server-cpu-revenue-to-surge-80-percent-2026-estimated-1-9m-ai-gpus-shipping-by-2027/

NVIDIA's Feynman GPUs will be the first to feature Co-Packaged Optics, but this wasn't always the case until the AI giant decided to switch gears. Co-Packaged Optics Were Many Years Away, But NVIDIA Decided To Move Ahead With Its Feynman GPUs CPO or Co-Packaged Optics (Silicon Photonics) is the next-generation solution thatΒ reduces reliance on copper and harnesses light to transfer signals. These CPOs are packaged alongside hardware accelerators such as GPUs and will be a key solution for next-gen AI factories, offering improved interconnect latency and creating high-bandwidth connections between CPU and GPU. If we go by the original plans, [β¦]
Read full article at https://wccftech.com/nvidia-fast-forwarded-co-packaged-optics-five-years-ahead-arriving-with-feynman-gpus/

Intel's Z-Angle Memory (ZAM) is approaching completion as it races towards taking a bite at the AI boom while challenging HBM as a viable alternative. Intel's ZAM Challenges HBM As A Big Memory Innovation In the High-Bandwidth, High-Capacity Segment Offering 2x The Speed of HBM4 Z-Angle Memory or ZAM has been stirring up a lot of talk in the memory segment. The upcoming memory standard is being developed by Intel and SoftBank & aims to offer a low-power, high-density replacement to HBM. Now, new details have been shared that provide more insight into ZAM memory. For starters, the new memory [β¦]
Read full article at https://wccftech.com/intel-zam-memory-threatens-hbms-ai-throne-with-2x-the-bandwidth-of-hbm4/

Intel's recently released Arc Pro B70 32 GB GPU has been tested in games, outperforming the Arc B580, and trading blows with the RTX 5060 Ti. Intel Arc Pro B70 GPU Gaming Benchmarks Give Us A Hint of What The Arc B770 "Big Battlemage" GPU Could've Offered To Gamers Back in March, Intel launched its Arc Pro B70 graphics card based on the Battlemage BMG-G31 GPU, which we all know as Big Battlemage. This bigger Battlemage chip was long-awaited in the gaming segment, but Intel decided to focus its efforts towards the AI market, equipping the card with a large [β¦]
Read full article at https://wccftech.com/intel-arc-pro-b70-32-gb-gpu-tested-in-games-65-percent-faster-vs-b580-trades-blows-with-5060-ti/

APX or Advanced Performance Extensions are the next evolution of x86 as Intel & AMD co-develop new standards for the architecture. APX Expands the x86 Instruction Set, Bringing Faster Performance & New Features That Will Benefit Both Intel and AMD's Next-Gen Chips Two days ago, we talked about ACE (AI Compute Extensions), which is a unified instruction set that aims to increase matrix-multiply performance for next-gen x86 chips. ACE is just one part of the grander scheme in which both Intel and AMD are working together to evolve the x86 architecture under a single unified framework through the recently established [β¦]
Read full article at https://wccftech.com/intel-amd-work-on-apx-the-next-major-step-in-the-evolution-of-x86-architectures/

