A previous leak revealing that there could be potentially six versions of the Snapdragon 8 Elite Gen 6 Pro has been clarified by new findings showing the block diagrams of Qualcomm’s first 2nm chipset. To minimize the confusion, the San Diego firm is prepping just two variants, one with LPDDR5X RAM support, while the top-end one will offer LPDDR6. However, don’t count out Qualcomm introducing binned models of the Snapdragon 8 Elite Gen 6 Pro, because the way its handset business is hurting, it’ll need to adopt the “Apple” approach. Top-end Snapdragon 8 Elite Gen 6 Pro may also offer Qualcomm […]

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The slightly advanced 2nm ‘N2P’ process from TSMC is reportedly being used by Qualcomm and MediaTek, with both companies aiming to gain an advantage over Apple later this year. However, the Cupertino firm is expected to match its rivals’ competitiveness by adopting the same manufacturing process next year for the A21 Pro, but only the latter will receive preferential treatment for the improved technology, not the A21. Standard A21 for the base iPhone 20 could stick with TSMC’s 2nm N2, as wafer and memory costs threaten to chew through Apple’s profits In a report from Commercial Times, Apple is reported […]

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Chip manufacturing giant Intel has partnered up with Taiwan's second-largest contract chip manufacturer, United Microelectronics Corporation (UMC), for advanced manufacturing process technology, suggests a report from FundaAI. Intel, under its CEO Lip-Bu Tan, is seeking to compete with Taiwan's TSMC in the contract chip manufacturing industry. According to the details, UMC is seeking to team up with Intel to gain a foothold in advanced chip manufacturing without having to expend significant amounts of capital for the machinery. Intel & Taiwan's Second Largest Chip Manufacturer Team Up For 12nm & 3nm Nodes - Report While most of the focus when it […]

Read full article at https://wccftech.com/report-intel-partners-with-taiwans-umc-on-3nm-chips-taking-direct-aim-at-tsmcs-foundry-dominance/

ASML CEO, Christophe Fouquet, believes that the demand from Elon Musk's Terafab project will be similar to fabrication plants capable of manufacturing millions of wafers per month. The executive spoke to Bloomberg, and his discussion ranged from data centers in space to the current stage of the semiconductor industry in the context of major demand from the AI buildout and Europe's position in the AI race. ASML CEO Says Europe Is Quite Behind In The AI Race The Terafab project was announced by Musk earlier this year as part of his efforts to procure chips for Tesla's edge computing and […]

Read full article at https://wccftech.com/asml-ceo-warns-europe-is-quite-behind-in-ai-race-as-us-buys-80-of-advanced-chips/

By now, everyone and their grandmother is familiar with ASML, the sole provider of EUV (Extreme Ultraviolet) capable lithography machines in the world. As hyperscalers continue to aggressively build out compute, we constantly discover new bottlenecks at almost every level of Jensen's five-layer AI cake, down to an insulating film supplied by, of all things, an MSG manufacturer. Yet for all the novel bottlenecks that crop up, there remains a perennial, critical constraint to AI build-out: the capacity of leading fabs to produce wafers on bleeding-edge process nodes. In other words, this bottleneck is EUV capacity, as all sub-7 nm […]

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Korean memory manufacturer Samsung is gearing up to produce its next-generation 1d DRAM, suggests a report from the Korean media. 1d manufacturing technology is the latest in the industry, and it is equivalent to Micron's 1-delta node. As of now, Samsung is discussing equipment plans for the next-generation RAM with its manufacturing partners as part of its preparation to begin mass production as early as late 2027. Samsung Evaluating Internal Capabilities for 1d DRAM Production, Says Report Industry sources quoted by ZDNet Korea outline that Samsung is developing equipment with its partners to kick off the next generation DRAM production. […]

Read full article at https://wccftech.com/samsung-targets-late-2027-for-1d-dram-mass-production-racing-to-power-next-gen-hbm5-ai-memory/

A standard Snapdragon 8 Elite Gen 6 followed by the premium Snapdragon 8 Elite Gen 6 Pro are slated to launch later this year, becoming Qualcomm’s first 2nm chipsets to arrive to the market. However, the advanced lithography is rumored to make the top-end SoC ludicrously expensive, but according to the latest leak, there could be six samples for Qualcomm’s partners to choose from, offering a diversified lineup for manufacturers to mix and match their launches and reduce their chipset expenditure. New leak reveals the Snapdragon 8 Elite Gen 6 Pro may also have varying CPU and GPU clock speeds to […]

Read full article at https://wccftech.com/six-snapdragon-8-elite-gen-6-pro-samples-available-for-testing/

Hygenco, Rylo, Ola Electric, and more raised funds this week.

The company overtook Toyota Motor, valued at 43.8 trillion yen (US$273 billion), as investors continued buying AI-related chip stocks.