Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years. Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands. TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased […]

Read full article at https://wccftech.com/intel-backed-glass-substrates-tech-will-be-commercilization-ready-within-three-years/

FinalWire has released the updated AIDA64 software, offering support for next-gen CPUs such as AMD Zen 6 APUs & Intel Nova Lake. AMD Zen 6 "Ryzen" CPUs & Intel Nova Lake Get Early Support In AIDA64 v8.30 The latest AIDA64 release has some major updates. One of these is AIDA FPS, which expands the feature set of the software suite with a new module that captures real-time FPS data from DX11 and DX12 games. The data can be displayed across all existing outputs, including SensorPanel, OSD, tray icons, and logging. The full change log is listed below: New in AIDA64 […]

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Corsair has just launched its ThermalProtect PCIe 5.1 600W cable for 16-pin GPUs with over-temperature protection to safeguard your graphics cards. Corsair Is The Latest Manufacturer To Offer A Safer Cable With Built-In OTP To Safeguard 16-Pin GPUs Running a 16-pin graphics card has become a scary ordeal. You will constantly be checking real-time monitoring utilities, the physical connectors, and your PC for fluctuations because 16-pin cards have a higher chance of dying due to the flimsy nature of the connector. Every day, you hear an RTX 5090 or a similar 16-pin graphics card card either burning up or dying […]

Read full article at https://wccftech.com/corsair-16-pin-cable-shuts-down-your-gpu-the-moment-the-connector-gets-too-hot/

NVIDIA is launching a new configuration of its highly popular GeForce RTX 5070 Laptop GPU, which features 12 GB of memory. NVIDIA GeForce RTX 5070 Laptops Are Very Popular & Now Getting a 12 GB Memory Option NVIDIA's GeForce RTX 5070 laptops are highly popular in the gaming segment. These laptops not only offer great gaming performance, but they also pack strong AI capabilities, making them an ideal choice for mainstream users. Now, NVIDIA is expanding its GeForce RTX 5070 Laptop lineup with a brand new configuration. The new configuration packs 12 GB of memory, a 50% boost over the […]

Read full article at https://wccftech.com/nvidia-bumps-rtx-5070-laptop-gpu-to-12gb-gddr7-memory/

Samsung recently exited low-end NAND and DRAM businesses, which has resulted in a major boost for Taiwanese and Chinese markets. Taiwan-Based NAND Maker, Macronix, Sees Big 4x Boost In MLC Business As Samsung Focues on High-End Products Recently, we reported that Samsung had exited LPDDR4 and LPDDR4X memory segments to focus on the more lucarative LPDDR5/X memory, which is a hot item for AI. The semiconductor giant also closed its MLC NAND business to focus on higher-end NAND products. While this led to a short disruption in the memory and NAND markets for entry-level platforms, others have filled in the […]

Read full article at https://wccftech.com/samsung-exiting-mlc-nand-buisness-opens-up-space-for-taiwanese-nand-maker/

ACEMAGIC has launched its brand new Mini PC, which packs AMD's Ryzen AI 9 HX 470, and starts at a price point of $759. ACEMAGIC Highlights Multi-Use Case Design of its F5A Mini PC, Which Packs AMD's Fastest Gorgon Point APU, The Ryzen AI 9 HX 470 Mini PCs make compact Agentic AI possible, and for this purpose, ACEMAGIC is releasing its brand new F5A Mini PC. The Mini PC is just as compact as one might expect, giving your PC setup a lot of breathing space. In terms of specs, the F5A comes packed with an AMD Ryzen AI […]

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High-Bandwidth Flash or HBFD, the memory that offers more capacity than HBM, will not be used by NVIDIA; instead, Google is going to be a key customer. NVIDIA To Keep on Using HBM, HBF Not Yet In Consideration, But Set For Sampling Later This Year NAND DRAM has seen big adoption with the recent AI push. While primarily used for storage, such as SSDs, the upcoming flash memory technology could play a major role with HBF (High-Bandwidth Flash), the next generation NAND DRAM tech that bridges the gap between HBM and NAND Flash. HBF is being co-developed by SanDisk and […]

Read full article at https://wccftech.com/nvidia-not-interested-in-hbf-memory-despite-4tb-stacks-dwarfing-hbm/

AMD AI PCs are seeing massive adoption in the enterprise segment as Agentic AI rages on to be the next frontier of computing. Only 4% of Organizations Don't Have Plans To Deploy AI PCs; the rest have already deployed AI PCs, as AMD leads the charge in the AI PC Segment The focus on localized AI and the rise of Agentic AI have rapidly boosted the adoption of AI PCs. This has led AMD to see a big demand for AI PCs in the Enterprise segment as organizations shift their workflows, aligning with future AI requirements. AI is reshaping how […]

Read full article at https://wccftech.com/amd-says-ai-pcs-are-the-new-enterprise-standard-for-agentic-ai/

Major CPU manufacturers such as Intel, AMD & MediaTek are boosting their CPU production, but prices continue to rise. CPU Makers Boost Production, But This Won't Change Current Pricing Trends & Shortages Agentic AI demand has prompted a CPU shortage that has further led prices to increase. As demand swells, the GPU to CPU ratio has fallen from 8:1 to 4:1, and is on the path to hit 1:1 sooner or later. As processors continue to face supply constraints, multiple chipmakers are now boosting their production capacities. Supply chain sources indicate that after Intel decided to prioritize its limited production […]

Read full article at https://wccftech.com/intel-amd-mediatek-are-boosting-cpu-production-prices-continue-to-increase/

Intel & Microsoft have joined hands to scale up Azure Local deployments from 100s to 1000s of servers using Xeon 6 CPUs. Microsoft & Intel Scale Up "Azure Local" From 100s to 1000s With Xeon 6 CPUs, Adjusting To User Needs Without Architectural Redesign Press Release: Azure Local is the foundation for Microsoft’s Sovereign Private Cloud, allowing organizations to run cloud-consistent infrastructure on hardware they own and operate within their sovereign boundary. It supports deployments across connected, intermittently connected, or fully disconnected environments. With Azure Local disconnected operations, customers retain the ability to apply policy enforcement, role-based access control, auditing, […]

Read full article at https://wccftech.com/intel-xeon-6-accelerate-amazons-azure-local-scaling-deployments-to-1000s-of-servers/

Microsoft's Shader Model 6.10 and AgilitySDK 1.720 are now available in preview, expanding the DX12 API with brand new features. Microsoft DX12 Linear Algebra "Matrix" APIs, Group Wave Index, Raytracing Intrinsics, More With Shader Model 6.10 & AgilitySDK 720 Preview Release Today's launch expands on the previous release of Shader Model 6.9, DXR 1.2, and other enhancements, which were part of the AgilitySDK 1.619. With the release of the AgilitySDK 1.720 preview, Shader Model 6.10 and several other features listed below are being added to the DX12 API: inalg::Matrix Shader Model 6.10 introduces a set of Matrix APIs covering a […]

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China has unveiled its new supercomputer, called LineShine, in Shenzen, which will deliver 2 ExaFlops of compute performance. The Chinese LineShine Supercomputer Is All Set To Become The Fastest In The World, Exceeding 2 ExaFlops During a conference at the National Supercomputing Center in Shenzhen today, the fastest domestic supercomputer project was announced. Known as LineShine, the Supercomputer will be built in two phases and will deliver over 2 ExaFlops of compute. Currently, the world's fastest supercomputer is the AMD-based El Capitan, which has a peak compute of 2.8 Exaflops. Coming to the specifications, the LineShine Supercomputer is purely a […]

Read full article at https://wccftech.com/chinas-lineshine-supercomputer-2-exaflops-47000-cpus-zero-reliance-on-foreign-chips/

Intel now gives users the ability to allocate up to 93% of system memory to Arc iGPUs, enabling wider AI LLM support. Trying To Run AI LLMs That Don't Fit On Your Arc iGPU? Intel Made It Possible By Allowing You To Dedicate Up To 93% System Memory In Its Latest Drivers Intel has dropped a new HotFix driver for Arc Pro Graphics, 302.0.101.8517 - Q1.26 R2, which lets users allocate even more system memory to the GPU, ideal for running larger AI LLMs. Previously, Intel's Drivers were able to allocate up to 87% of the system memory to the […]

Read full article at https://wccftech.com/intel-drivers-lets-users-allocate-93-percent-system-memory-to-arc-igpus-wider-ai-llm-support/

AMD is enabling CUDIMM DDR5 memory support with new AGESA updates & upcoming EXPO 1.2 tech, but only next-gen Ryzen CPUs will enable it. DDR5 CUDIMM Support on AM5 Platforms Limited By IMC; Only Next-Gen AMD Ryzen CPUs Support It Recently, there has been a lot of talk regarding AMD EXPO 1.2 and how it's bringing improved DDR5 memory support to AM5 platforms. It all started when ASUS launched its latest AGESA BIOS, which added EXPO 1.2 support on X870 series motherboards. Soon after ASUS's release, more details for EXPO 1.2 were shared, which suggested CUDIMM & CSODIMM support, along […]

Read full article at https://wccftech.com/amd-expo-1-2-cudimm-ddr5-memory-next-gen-ryzen-cpus-current-cpus-bypass-mode/

A major DRAM & NAND crisis is impending as Samsung faces an 18-day strike in May, which could disrupt the global supply chain. DRAM & NAND Output Will See Up To 4% Disruption In May As Samsung Faces 18-Day Strike DRAM & NAND production is already facing supply constraints, and to make matters worse, Samsung union workers are expected to go on an 18-day strike as the company is unwilling to meet the salary-related demands. As per reports, Samsung's union workers are asking the company for bonuses, demanding a 15% of Samsung's annual operating profit, which amounts to around $30 […]

Read full article at https://wccftech.com/samsung-18-day-strike-cut-off-dram-nand-output-recovery-will-take-2-3-weeks/

Intel is not only rolling right now, but also operating smartly, driving its revenue up by salvaging CPU dies and selling them off to hungry AI customers. CPUs Demand Is So High Right Now That Intel Got an Unexpected Margin Lift By Selling Salvaged Chips CPU demand is going off the charts as AI inferencing continues to surge with the arrival of Agentic AI. In countless posts, we have stated why CPUs have become so important for AI, a market that was previously dominated by GPUs. Now, AI inferencing is going after CPUs and Memory, in a big way, and […]

Read full article at https://wccftech.com/intel-selling-cpu-dies-it-used-to-throw-in-the-trash-ai-demand-turns-scrap-into-profts/

Foxconn will be the lead supplier for NVIDIA's Groq 3 LPX, a chip designed specifically to boost AI inferencing capabilities. NVIDIA Vera Rubin Platforms To Benefit Greatly From Groq 3 LPX For Boosting AI Inferencing, Driving Foxconn's Share To Record Levels At GTC 2026, NVIDIA announced its Groq 3 LPX chip, in addition to the Vera Rubin AI platform. The Groq 3 LPX is an LPU that is designed to boost AI inferencing by up to 35x. The Groq 3 LPX rack will feature a total of 256 chips with 128 GB of SRAM and 12 TB of DDR5 memory, […]

Read full article at https://wccftech.com/nvidia-35x-ai-inferencing-leap-arrives-early-foxconn-fast-fowards-groq-3-lpx-racks/

Intel Core 5 320, a Wildcat Lake CPU designed for budget laptops, has been tested, showcasing good numbers against its competition. Intel Wildcat Lake, Core 5 320, Shows ST and MT Wins Against Current-Gen Chips While Offering 50% iGPU Performance With Just A Quarter of The Xe3 Cores Wildcat Lake should turn out to be a surprise hit from Intel if OEMs build upon the reference design and specs. Just recently, we saw a stunning reference design from Intel, featuring an aluminum body, stunning colors, and decent specs for an everyday PC. Now, we have the first independent benchmarks coming […]

Read full article at https://wccftech.com/intel-budget-wildcat-lake-chip-beats-apples-macbook-neo-a18-pro/

Google's next-generation TPUv8e AI chip will reportedly utilize Intel Foundry's EMIB packaging, marking a series of wins for Intel in recent days. Intel Foundry Might Be Making Google's Next-Gen TPU With Its Advanced Packaging "EMIB" Capabilities Intel has been in the limelight for the past couple of days as it buisnesses gain traction from the recent surge in Agentic AI, which has led to CPUs becoming the hottest commodity after GPUs and memory. Now, reports are coming from Taiwanese outlet, Commercial Times, that Google will leverage Intel's EMIB technology for its next-generation TPU chip. Intel Foundry has already secured Tesla […]

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Taiwan-based manufacturer is reportedly the country's first to offer LPDDR5X memory for NVIDIA Vera Rubin platforms as the green team diversifies its supply chain to power its Agentic AI powerhouse. NVIDIA Diversifies Its Supply Chain, Adding Taiwan-Based Memory Maker For Vera Rubin's LPDDR5X Solution NVIDIA will require a lot of memory, both low-power and high-bandwidth, to fuel the growing needs of Agentic AI with its Vera Rubin platforms. We know that NVIDIA's Vera Rubin makes use of two types of memory. The Vera CPUs use LPDDR5X DRAM while Rubin GPUs use HBM4 DRAM. Both of these have different purposes. HBM4 […]

Read full article at https://wccftech.com/nvidia-taps-taiwanese-nanya-tech-lpddr5x-memory-for-vera-rubin-platform/

TSMC's production lines are being expanded to accommodate more wafer capacity, with a key focus on the new 2nm and 3nm lines. TSMC Focuses Full Efforts To Expand 2nm and 3nm Capacity As Supply In Shock After Huge Demand From AI Firms Recently, AI firms announced that they will be expanding their compute capabilities big time. This massive expansion means that more chips will be required as these are multi-year projects that will address current & future needs. TSMC, being the leading semiconductor maker, has been enjoying this extra demand, but at the same time, the production lines continue to […]

Read full article at https://wccftech.com/tsmc-3nm-2nm-wafer-output-to-be-boosted-by-the-end-of-2026/

Samsung has reportedly produced the world's first "standalone" DRAM module that uses a process tech below 10nm. Samsung's New Sub-10nm DRAM Technology To Boost Densities & Uses New Materials For long, the DRAM industry has relied on a 10nm process technology for producing integrated circuits. 10nm DRAM technologies range from 1x, 1y, 1x, 1a, 1b, 1c, and 1d. Now, Samsung is working on a brand new 10a process technology for DRAM that goes below the official "10nm" process limit. Samsung Electronics has produced the world's first single-digit nanometer DRAM working die. It is reported that the company plans to rapidly […]

Read full article at https://wccftech.com/samsung-breaks-10nm-dram-barrier-new-4f-cell-structure-boosts-density/

DeepSeek V4 is out, bringing major optimizations, including up to 1.6T model sizes, and NVIDIA is ready with Day-0 support on Blackwell GPUs using NVFP4. NVIDIA Blackwell NVFP4 Architecture Delivers Major Speed-Ups In DeepSeek v4 With More Optimizations On The Way With the launch of DeepSeek V4, we saw some major optimizations in compute & memory requirements. The updated AI model uses just 27% of single-token inference FLOPs & 10% of the KV cache when running a one-million-token context window. Two new models were also introduced, one being a Pro model with a parameter size of 1.6T, and a Flash version […]

Read full article at https://wccftech.com/nvidia-beats-everyone-to-deepseek-v4-day-0-blackwell-support-pushing-3500-tokens-on-1-6t-models/

Think of DRAM, but in a NAND-like structure, that's the basic concept of 3D X-DRAM, a revolution for the memory markets, bringing higher densities for AI. 3D X-DRAM Is Now Closer To Reality, An HBM-Replacement That Offers Higher Densities For AI In 2023, US-based NEO Semiconductor announced its brand new project called 3D X-DRAM, which was going to address the DRAM capacity bottleneck by leveraging a 3D NAND-like architecture. The company also unveiled two 3D X-DRAM cells, which will be integrated into memory solutions based on 3D X-DRAM. These include 1T1C and 3T0C DRAM cells, offering up to 512Gb, a […]

Read full article at https://wccftech.com/3d-x-dram-hits-proof-of-concept-hbm-replacement-10x-density-high-yield-memory/

AMD's next-generation SP8 & SP7 sockets, designed for the Zen 6-powered EPYC Venice & Verano CPUs, have been detailed. AMD SP8 & SP7 Sockets Are Bigger Than Their Predecessors, Showcasing The Compute Density Increase For Next-Gen EPYC Venice & Verano CPUs Last year, AMD announced its EPYC Venice & EPYC Verano CPUs. The former comes with up to 256 cores in Zen 6C flavors with a launch scheduled for 2026, while the latter is a cost-effective Zen 6 offering that's slated for a 2027 launch. Now, Taiwanese component manufacturer HELM Technology has revealed the new socket, each featuring a larger […]

Read full article at https://wccftech.com/amd-sp8-socket-for-epyc-venice-sp8-socket-for-verano-cpus-detailed/

Intel is making some big changes to its desktop gaming roadmap to deliver faster performance, with new hardware & software technologies. Intel Says They Want To Match AMD X3D CPUs By Changing Their Entire Gaming Desktop Strategy Over the Next Five Years In an interview with PCGameshardware, Robert Hallock has shared the plans of the client CPU team covering desktops, laptops, and handheld PC markets. Robert has been giving us some hints of their strategy over the past few weeks, and it looks like Intel is on the right path. A key change in Intel's desktop strategy came around after […]

Read full article at https://wccftech.com/intel-rewrites-five-year-desktop-gaming-roadmap-betting-on-software-big-time/