Intel is not only rolling right now, but also operating smartly, driving its revenue up by salvaging CPU dies and selling them off to hungry AI customers. CPUs Demand Is So High Right Now That Intel Got an Unexpected Margin Lift By Selling Salvaged Chips CPU demand is going off the charts as AI inferencing continues to surge with the arrival of Agentic AI. In countless posts, we have stated why CPUs have become so important for AI, a market that was previously dominated by GPUs. Now, AI inferencing is going after CPUs and Memory, in a big way, and […]

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Foxconn will be the lead supplier for NVIDIA's Groq 3 LPX, a chip designed specifically to boost AI inferencing capabilities. NVIDIA Vera Rubin Platforms To Benefit Greatly From Groq 3 LPX For Boosting AI Inferencing, Driving Foxconn's Share To Record Levels At GTC 2026, NVIDIA announced its Groq 3 LPX chip, in addition to the Vera Rubin AI platform. The Groq 3 LPX is an LPU that is designed to boost AI inferencing by up to 35x. The Groq 3 LPX rack will feature a total of 256 chips with 128 GB of SRAM and 12 TB of DDR5 memory, […]

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Intel Core 5 320, a Wildcat Lake CPU designed for budget laptops, has been tested, showcasing good numbers against its competition. Intel Wildcat Lake, Core 5 320, Shows ST and MT Wins Against Current-Gen Chips While Offering 50% iGPU Performance With Just A Quarter of The Xe3 Cores Wildcat Lake should turn out to be a surprise hit from Intel if OEMs build upon the reference design and specs. Just recently, we saw a stunning reference design from Intel, featuring an aluminum body, stunning colors, and decent specs for an everyday PC. Now, we have the first independent benchmarks coming […]

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Google's next-generation TPUv8e AI chip will reportedly utilize Intel Foundry's EMIB packaging, marking a series of wins for Intel in recent days. Intel Foundry Might Be Making Google's Next-Gen TPU With Its Advanced Packaging "EMIB" Capabilities Intel has been in the limelight for the past couple of days as it buisnesses gain traction from the recent surge in Agentic AI, which has led to CPUs becoming the hottest commodity after GPUs and memory. Now, reports are coming from Taiwanese outlet, Commercial Times, that Google will leverage Intel's EMIB technology for its next-generation TPU chip. Intel Foundry has already secured Tesla […]

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Taiwan-based manufacturer is reportedly the country's first to offer LPDDR5X memory for NVIDIA Vera Rubin platforms as the green team diversifies its supply chain to power its Agentic AI powerhouse. NVIDIA Diversifies Its Supply Chain, Adding Taiwan-Based Memory Maker For Vera Rubin's LPDDR5X Solution NVIDIA will require a lot of memory, both low-power and high-bandwidth, to fuel the growing needs of Agentic AI with its Vera Rubin platforms. We know that NVIDIA's Vera Rubin makes use of two types of memory. The Vera CPUs use LPDDR5X DRAM while Rubin GPUs use HBM4 DRAM. Both of these have different purposes. HBM4 […]

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TSMC's production lines are being expanded to accommodate more wafer capacity, with a key focus on the new 2nm and 3nm lines. TSMC Focuses Full Efforts To Expand 2nm and 3nm Capacity As Supply In Shock After Huge Demand From AI Firms Recently, AI firms announced that they will be expanding their compute capabilities big time. This massive expansion means that more chips will be required as these are multi-year projects that will address current & future needs. TSMC, being the leading semiconductor maker, has been enjoying this extra demand, but at the same time, the production lines continue to […]

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Samsung has reportedly produced the world's first "standalone" DRAM module that uses a process tech below 10nm. Samsung's New Sub-10nm DRAM Technology To Boost Densities & Uses New Materials For long, the DRAM industry has relied on a 10nm process technology for producing integrated circuits. 10nm DRAM technologies range from 1x, 1y, 1x, 1a, 1b, 1c, and 1d. Now, Samsung is working on a brand new 10a process technology for DRAM that goes below the official "10nm" process limit. Samsung Electronics has produced the world's first single-digit nanometer DRAM working die. It is reported that the company plans to rapidly […]

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DeepSeek V4 is out, bringing major optimizations, including up to 1.6T model sizes, and NVIDIA is ready with Day-0 support on Blackwell GPUs using NVFP4. NVIDIA Blackwell NVFP4 Architecture Delivers Major Speed-Ups In DeepSeek v4 With More Optimizations On The Way With the launch of DeepSeek V4, we saw some major optimizations in compute & memory requirements. The updated AI model uses just 27% of single-token inference FLOPs & 10% of the KV cache when running a one-million-token context window. Two new models were also introduced, one being a Pro model with a parameter size of 1.6T, and a Flash version […]

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Think of DRAM, but in a NAND-like structure, that's the basic concept of 3D X-DRAM, a revolution for the memory markets, bringing higher densities for AI. 3D X-DRAM Is Now Closer To Reality, An HBM-Replacement That Offers Higher Densities For AI In 2023, US-based NEO Semiconductor announced its brand new project called 3D X-DRAM, which was going to address the DRAM capacity bottleneck by leveraging a 3D NAND-like architecture. The company also unveiled two 3D X-DRAM cells, which will be integrated into memory solutions based on 3D X-DRAM. These include 1T1C and 3T0C DRAM cells, offering up to 512Gb, a […]

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AMD's next-generation SP8 & SP7 sockets, designed for the Zen 6-powered EPYC Venice & Verano CPUs, have been detailed. AMD SP8 & SP7 Sockets Are Bigger Than Their Predecessors, Showcasing The Compute Density Increase For Next-Gen EPYC Venice & Verano CPUs Last year, AMD announced its EPYC Venice & EPYC Verano CPUs. The former comes with up to 256 cores in Zen 6C flavors with a launch scheduled for 2026, while the latter is a cost-effective Zen 6 offering that's slated for a 2027 launch. Now, Taiwanese component manufacturer HELM Technology has revealed the new socket, each featuring a larger […]

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Intel is making some big changes to its desktop gaming roadmap to deliver faster performance, with new hardware & software technologies. Intel Says They Want To Match AMD X3D CPUs By Changing Their Entire Gaming Desktop Strategy Over the Next Five Years In an interview with PCGameshardware, Robert Hallock has shared the plans of the client CPU team covering desktops, laptops, and handheld PC markets. Robert has been giving us some hints of their strategy over the past few weeks, and it looks like Intel is on the right path. A key change in Intel's desktop strategy came around after […]

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TSMC's key supplier has stated that no technology was leaked to China, but it also filed a lawsuit against its former General Manager. TSMC Supplier Denies That Key Technology Was Leaked To China, But Files A Lawsuit Against Its Former General Manager GPTC (Grand Process Technology Corporation), which is a key supplier for TSMC's Advanced Packaging solutions such as CoWoS, has denied recent reports that key TSMC technology was leaked to China. In a recent press release, the company confirmed that no technology leaks were observed after recent rumors emerged. However, at the same time, the company has filed a […]

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Intel's next-gen Xeon "Diamond Rapids" CPUs will offer up to 512 cores, while Coral Rapids will bring back SMT on 8-channel platforms in 2028. Intel Diamond Rapids 16-Channel Slips Into 2027, Features Up To 512 Cores Intel Diamond Rapids "Xeon" CPUs were going to launch this year, but delays in plans have pushed it to 2027. The delay can be attributed to several reasons, such as yields and the fact that the 8-channel line was cancelled. Now, Intel plans to launch Diamond Rapids "Xeon" CPUs in 2027. As per Jaykihn, Intel's mid-2027 plans for Diamond Rapids include a volume launch […]

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Intel's upcoming GPU plans have been disclosed, highlighting Xe3P without discrete gaming parts, Xe4 in 2027 & a next-gen Xe architecture in 2028. Intel Xe GPU Plans: Xe3P In iGPU & AI Discrete Flavors, Xe4 In 2027, Xe-Next In 2028 Intel is working on three next-gen Xe GPU architectures, which will form the basis of its graphics lineup in the years ahead. At the same time, the lineups include both integrated and discrete GPUs; the discrete gaming lineup is missing out on the action. Intel Xe3P GPU Architecture In 2026 Starting with the first Xe microarchitecture, we have Xe3P, which […]

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Qualcomm is rumored to be preparing a brand new datacenter CPU, which will be just in time to power growing Agentic AI needs. Rumors that Qualcomm's New Datacenter CPU is just a few months away may not sound crazy, given the demand there is for agentic AI There's a rumor going around that Qualcomm is working on its very own "dedicated" Datacenter CPU based on the Arm architecture. Qualcomm making its own Datacenter CPU at some point was expected, but what the new rumor is suggesting is that we could see that chip being announced as early as June this […]

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Meta has partnered with Amazon's AWS to bring tens of millions of Graviton CPU cores to its AI compute portfolio for Agentic AI. The CPU Is The New GPU For Agentic AI - Meta is adding millions of Amazon AWS Graviton CPU Cores To Its AI Infrastructure. As the Agentic AI era rages on, companies are rapidly expanding their AI infrastructure to meet rising compute demands. We have seen multi-GigaWatt deals being signed here and there, and CPU usage is on the rise. With all of this happening, Meta has also announced its blockbuster partnership with Amazon's AWS. The new […]

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Intel announced that its ZAM memory project, which is being developed with SoftBank's subsidiary, SAIMEMORY, has received a big boost from Japan. Japan Accelerates The 3.5-Year Development Plan of ZAM, A Memory Revolution By Intel & SoftBank In its latest presser, Intel Kabushiki Kaisha (Intel K.K.) and SoftBank Corp. subsidiary SAIMEMORY have unveiled that Japan's NEDO (New Energy and Industrial Technology Development Organization) has now selected ZAM, a next-generation memory standard which is being seen as an HBM replacement. With the selection of ZAM by NEDO, the program will fund the project through government subsidies, accelerating its development to address […]

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AMD EXPO 1.2 is launching soon, and with it, some new features, along with support for Chinese DDR5 memory, are being added too. AMD EXPO 1.2 Enables Support For Chinese DDR5 Memory Makers To Tackle DRAM Shortages & Increasing Prices New information about EXPO 1.2 comes from 1usmus, the author of HYDRA, CTR, and DRAM calculator for Ryzen, & leaker chi11eddog. The new information covers various aspects of the new memory tech, which is anticipated soon. Starting with the details, AMD EXPO 1.2 will be adding support for module geometry, allowing users to mix and match various memory capacities. But […]

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ASUS has become the first motherboard maker to enable AMD's next-gen EXPO 1.2 technology support on its X870 motherboards, bringing faster DDR5 memory standards to Ryzen platforms. ASUS First To Land AMD EXPO 1.2 Memory Technology Support on Its X870 Motherboards: Offers CUDIMM & Ultra Low-Latency DDR5 Support ASUS has released its new "2301" BETA BIOS, which includes one big feature that will be coming to current and upcoming AM5 motherboards: support for AMD EXPO 1.2. This technology will play an important role when coupled with the next-gen Ryzen "Zen 6" CPU family. Currently, the EXPO 1.2 support is in […]

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Intel has confirmed that it will have multiple internal chip tape-outs using the 14A process technology, which will be seen as the Foundry's cleverest move to date. Intel Wants More Customers To Use 14A, And What Best Way To Make It Possible By Exerting Confidence With Its Own Products Using the Technology. Intel has gained Tesla as a 14A customer, which is the Foundry's biggest win so far, and they also have multiple external customers lining up as the company finalizes its 0.9 PDK. But while the 14A interest is gaining momentum, Intel just added a multiplier to the equation, […]

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Intel has officially announced that its 18AP and 14A nodes are seeing big customer engagements, with 14A already securing a win at Tesla. Intel 18AP & 14A Were Chipzilla's Biggest Bets, & They're Paying Off With Tesla Just Being The Beginning of What's To Come! During its Q1 2026 earnings call, Intel's CEO Lip-Bu Tan confirmed the recent partnership with Elon Musk's SpaceX, xAI, and Tesla to support the Terafab project. It was already confirmed that the 14A process tech will be deployed at TeraFab, marking a huge confidence boost for the chipmaker, which has spent years finding big names […]

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